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          X-Ray Defect Inspection for Wafers

          Bruker defect detection systems use X-ray diffraction imaging (XRDI) to detect crystalline defects, such as cracks, slip, dislocations, and micropipes on single-crystal substrates.

          These systems can detect the cracks that cause wafer breakage in Si wafers within semiconductor fabs. This defect inspection is performed without the use of etching acids. They can also be used to improve yield and quality of other high-value substrates, such as CdTe and SiC. 

          JV sensus tool imagev2

          JVSensus

          XRDI inspection system for crystaline defects in patterned and blanket wafers

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          JV-QCTT

          X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in wafers and ingot slices

          JV QCRT tool imagev2

          JV-QCRT

          X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in high value substrates

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